High-Reliability SMT Solder Paste

High-Reliability Solder Paste for Electronic Assembly

Product Positioning

Dawi high-reliability SMT solder paste is developed for automotive electronics, servers, communication equipment, industrial control, power electronics, high-end electronic products, and other applications requiring long-term solder-joint reliability.

By optimizing the alloy system, flux system, and rheology, the product balances stable printing, wetting, low-voiding performance, slump resistance, and solder-joint reliability. Material options can be matched to thermal cycling, high-temperature and high-humidity exposure, mechanical stress, and long-term service conditions.

Powder size, alloy, and microalloyed systems can be selected according to the product structure, PCB surface finish, operating temperature, and reliability requirements.

Product Features

• Reliable solder joints: Optimized joint microstructure and interface bonding for long-term service stability.
• Thermal-cycle reliability: Solder-joint resistance to thermal fatigue is considered for repeated temperature changes.
• High-temperature and high-humidity suitability: Material systems can be matched to demanding temperature and humidity conditions.
• Low-voiding design: Supports dense solder joints for power devices and high-reliability electronic assembly.
• Mechanical reliability: Addresses shear strength, vibration resistance, and connection reliability under mechanical stress.
• Stable printing: Controlled rheology and stencil release support continuous production.
• Wetting performance: Suitable for common PCB surface finishes including OSP and ENIG.
• Microalloy options: Ni, Bi, Sb, and Ge microalloyed systems can be evaluated according to application requirements.

Reliability Evaluation

Thermal Cycling: Evaluation of thermal fatigue, interface bonding, and IMC-layer stability.

High Temperature and High Humidity: Evaluation of solder-joint and residue stability in demanding temperature and humidity environments.

Void Analysis: Evaluation of void distribution, solder-joint density, and process stability.

Shear Strength: Evaluation of mechanical strength and interface bonding.

Metallographic Analysis: Analysis of microstructure, IMC layers, interfaces, cracks, and failure characteristics.

Typical Applications

Automotive Electronics | ADAS Domain Controllers | Servers | AI Servers | Communication Equipment | Industrial Control | Power Modules | IGBT / SiC | High-End Consumer Electronics | High-Reliability PCBA

Powder Type / Particle Size

Type 4 (T4): 20–38 μm
Type 5 (T5): 15–25 μm

Alloy Systems

Sn96.5Ag3.0Cu0.5
Sn98.5Ag1.0Cu0.5

Microalloy options: Ni / Bi / Sb / Ge