Senior Solder Paste R&D Engineer

Key Responsibilities

1. Develop solder paste R&D roadmaps, technology upgrade plans, and continuous product improvement programs in alignment with the company’s strategy for electronic soldering and advanced packaging materials, industry trends, and customer requirements.
2. Lead the development of new solder paste products and formulations, with a focus on ultra-fine pitch, high-density interconnects, low voiding, high reliability, low residue, and high cleanliness.
3. Conduct in-depth research on the properties, compatibility, and formulation mechanisms of key raw materials, including solder powders, resins, activators, solvents, thixotropic agents, and functional additives. Continuously optimize rheology, printability, stencil release, wettability, slump resistance, reflow performance, and long-term reliability.
4. Develop and optimize T5/T6/T7/T8 ultra-fine powder solder pastes, including water-soluble and no-clean formulations, improving paste filling, stencil release, and continuous printing stability for micro-apertures, ultra-fine pitch, and micro-pad applications.
5. Conduct material–process compatibility studies and develop soldering material solutions for advanced packaging applications, including optical modules, Wafer, Flip Chip, BGA, WLCSP, Fan-Out/FOWLP, SiP, Mini/Micro LED, CPO/NPO, Chiplet, HBM, and CoWoS.
6. Lead the development, screening, evaluation, and qualification of new raw materials. Participate in supplier and raw-material quality management while continuously optimizing material systems and product cost without compromising product performance or reliability.
7. Perform root-cause analysis for product and process issues arising during R&D, manufacturing, and customer applications. Troubleshoot issues related to printing defects, insufficient solder, bridging, solder balls, poor wetting, voiding, residue, oxidation, and solder joint strength, and develop and implement corrective and preventive actions.
8. Collaborate closely with Application Engineering, Quality, Manufacturing, and Sales teams to understand customer applications and provide technical support for material selection, printing, reflow, cleaning, and soldering processes. Drive products through the complete commercialization cycle from R&D → Validation → Customer Qualification → Stable Mass Production.
9. Establish and continuously improve product formulations, experimental methods, technical standards, test databases, and R&D documentation, promoting standardized, data-driven, and systematic R&D management.
10. Continuously monitor global developments in electronic soldering materials, advanced packaging materials, emerging technologies, and competitive products, providing technical input for new product development and the company’s medium- to long-term technology roadmap.

Qualifications

1. Bachelor’s degree or above in Chemical Engineering, Applied Chemistry, Polymer Materials, Materials Chemistry, Fine Chemicals, Electronic Materials, or a related field. A Master’s degree or above is preferred.
2. At least 3 years of R&D experience in solder paste, flux, flux paste, electronic soldering materials, or advanced packaging materials. Candidates with independent experience in solder paste formulation development and mass-production implementation are preferred.
3. Strong knowledge of major solder paste raw materials and formulation systems, with the ability to understand and analyze the relationships among solder powder particle size, alloy systems, flux chemistry, rheological properties, printing performance, reflow soldering, residue, and cleaning performance.
4. Strong capabilities in formulation design, Design of Experiments (DOE), and data analysis, with the ability to independently conduct product development, performance evaluation, formulation optimization, and failure analysis.
5. Familiarity with SMT, precision stencil printing, and reflow soldering processes. Experience with T6/T7/T8 ultra-fine powder solder paste, Fine Pitch, Wafer, Flip Chip, optical modules, or advanced packaging applications is highly preferred.
6. Strong knowledge of solder joint characterization and reliability evaluation, with the ability to systematically analyze issues such as voiding, wetting, solder balls, bridging, slump, insufficient solder, residue, oxidation, and solder joint strength.
7. Strong logical thinking, systematic analysis, and problem-solving capabilities, with the ability to identify and resolve technical issues across the complete chain of Materials → Formulation → Process → Solder Joint → Reliability.
8. Excellent communication and cross-functional collaboration skills, with the ability to work effectively with R&D, Quality, Manufacturing, Sales, and customer engineering teams to drive product development and customer qualification projects.
9. Detail-oriented and highly responsible, with a strong awareness of technical confidentiality and intellectual property protection, as well as strong execution, learning, and project management capabilities.
10. Demonstrated enthusiasm for continuous learning and exploration of new materials, emerging processes, and advanced packaging technologies. Positive, resilient, and results-oriented, with the ability to take ownership of challenging R&D and customer projects.