DSP515HF Water-Soluble Solder Paste

Water-Soluble Solder Paste for High-Cleanliness Electronic Assembly

Product Positioning

Dawi DSP515HF water-soluble solder paste uses an active water-soluble flux system for high-cleanliness, high-reliability electronic assembly and precision packaging. Post-reflow flux residue can be removed with DI water, supporting applications with stringent requirements for ionic residue, surface cleanliness, and long-term reliability.

The product supports stable printing, wetting and spreading, slump resistance, low-voiding solutions, and a broad process window. Powder and alloy systems can be selected according to pitch, stencil aperture, device structure, and soldering temperature.

Product Features

• DI-water cleaning: Post-reflow residue can be removed with deionized water.
• High cleanliness: Cleaning helps reduce ionic residue and electrochemical-migration risk.
• Low-voiding options: Flux and reflow conditions can be optimized for solder-joint density and process stability.
• Broad process window: Supports coordinated printing, reflow, and cleaning processes.

Typical Applications

SiP | Automotive Electronics | Communication Equipment | Servers | Industrial Control | Medical Electronics | BGA Ball Attach | CSP Ball Attach | High-Reliability PCBA | Precision Electronic Assembly

Powder Type / Particle Size

Type 4 (T4): 20–38 μm
Type 5 (T5): 15–25 μm

Cleaning Guidance

Heated DI water is recommended. Water temperature, spray pressure, cleaning time, and drying conditions should be optimized according to the flux system, reflow conditions, residue level, board structure, and component stand-off height. For fine-pitch, low-standoff, and complex assemblies, verify the cleaning process on the actual product to confirm adequate residue removal.