Solder Paste for Laser, Selective and Localized Soldering

PRODUCT POSITIONING

Dawi laser and rapid soldering paste is developed for laser soldering, localized rapid heating, selective soldering, precision dispensing and rework. It is intended for precision electronic assemblies that require fast wetting, controlled deposits and stable localized soldering.

PRODUCT FEATURES

• Fast wetting for short, localized heating cycles.

• Designed for low spatter and low voiding under matched process conditions.

• Slump resistance during ambient and heated processing.

• Stable micro-dispensing for controlled solder deposits.

• Powder-size and alloy options for different component structures and soldering temperatures.

TYPICAL APPLICATIONS

Mini LED Rework | MEMS | Camera Modules | Voice Coil Motors | Optical Modules | TWS Devices | Sensors | Precision Electronic Assemblies

COMPATIBLE PROCESSES

Laser Soldering | Selective Soldering | Localized Soldering | Precision Dispensing | Rework

POWDER SIZE

T4: 20–38 μm

T5: 15–25 μm

T6: 5–15 μm

ALLOY SYSTEMS

Sn96.5Ag3.0Cu0.5

Sn98.5Ag1.0Cu0.5

Sn99Ag0.3Cu0.7

Sn64Bi35Ag1.0

Sn64.7Bi35Ag0.3

Sn42Bi58

Sn67Pb33

Sn5Pb92.5Ag2.5

The final powder size, alloy and process window must be selected according to the component structure, soldering temperature and application requirements.