Heat Sink Solder Paste

Solder Paste for Heat Sinks and Large-Area Thermal Interfaces

Product Positioning

Dawi heat sink solder paste is developed for heat sinks, thermal modules, copper substrates, and large-area thermal connections. It is suitable for dispensing, screen printing, stencil printing, and large-area solder-paste coating.

Based on low-temperature Sn-Bi and Sn-Bi-Ag alloy systems, the product is designed for wetting and spreading, low-voiding performance, low residue, slump resistance, and stable continuous application. It addresses uneven spreading, voids, solder overflow, and residue in large-area heat-sink soldering.

Typical uses include heat sinks, heat pipes, vapor chambers, copper-based thermal modules, electronic thermal components, and large-area thermal connections.

Product Features

• Large-area wetting: Optimized for copper and related metal substrates.
• Low-voiding design: Optimized to reduce voids in large-area solder layers.
• Low-temperature soldering: Sn-Bi alloy systems help reduce reflow peak temperature and thermal load.
• Slump resistance: Controls spreading and overflow.
• Low residue: Supports appearance and downstream processing.
• Process compatibility: Suitable for dispensing, screen printing, stencil printing, and large-area coating.
• Stable application: Controlled rheology and thixotropy support continuous production.
• Multiple alloy options: Alloys can be selected according to temperature, substrate structure, and reliability requirements.

Typical Applications

Heat Sinks | Thermal Modules | Heat Pipes | Vapor Chambers | Copper Heat Sinks | Electronic Thermal Components | Server Thermal Modules | GPU / CPU Heat Sinks | Large-Area Thermal Connections | Cold Plates | Liquid-Cooling Modules

Powder Size

25–75 μm
25–45 μm

Alloy Systems

Sn64Bi35Ag1.0
Sn64.7Bi35Ag0.3
Sn69.3Bi30Cu0.7
Sn42Bi58

Sn-Bi and Sn-Bi-Ag low-temperature alloy systems can be selected according to soldering temperature, heat-sink structure, substrate type, and reliability requirements.