Ultrafine High-Performance No-Clean Solder Paste

High-Performance No-Clean Solder Paste

Product Positioning

Dawi high-performance no-clean solder paste combines a low-residue no-clean flux system with Type 6, Type 7, and Type 8 ultrafine solder powders. It is developed for Mini LED direct-view displays, COB, optical modules, TEC, SiP, and high-density precision electronic packaging.

The product supports fine-pitch printing, small-aperture release, wetting and spreading, slump resistance, and continuous printing stability. Low post-reflow residue generally eliminates additional cleaning and helps simplify the production process.

Core Advantages

• Low-residue no-clean system: Generally requires no additional cleaning after reflow.
• Ultrafine-pitch printing: T6/T7/T8 powders support small-aperture filling and release for small-pad applications.
• Controlled deposit formation: Rheology and slump resistance support placement and shape consistency while reducing bridging risk.
• Continuous printing stability: Designed for extended stencil life and volume production.

Typical Applications

Mini LED | Micro LED | MIP | COB | Optical Modules | TEC | SiP | Flip Chip | Precision Electronic Packaging

Powder Type / Particle Size

Type 6 (T6): 5–15 μm
Type 7 (T7): 1–11 μm
Type 8 (T8): 1–8 μm

No-Clean System

Low Residue | No Clean | Efficient Processing

The low-residue flux system generally requires no additional cleaning after reflow, helping reduce cleaning steps for Mini LED, Micro LED, MIP, COB, optical modules, and other high-density assemblies.