Low-Residue Solder Paste for Formic Acid and Vacuum Reflow

PRODUCT POSITIONING

Dawi formic acid reflow solder paste is developed for formic-acid-atmosphere and vacuum reflow processes requiring high cleanliness, low residue and low voiding. The reducing atmosphere supports oxide removal, solder melting and wetting, while vacuum degassing can help control void formation under matched process conditions.

TYPICAL APPLICATIONS

Power Semiconductors | IGBT | SiC | MOSFET | Power Modules | Optoelectronic Devices | Sensors | Aerospace Electronics

PROCESS FLOW

Formic Acid Introduction → Oxide Reduction → Solder Melting & Wetting → Vacuum Degassing → Joint Formation

POWDER SIZE

T3 | T4 | T5 | T6

ALLOY OPTIONS

Lead-free, high-temperature, low-temperature and special alloy systems can be selected according to the device structure, soldering temperature and reliability requirements.

The achievable void level must be verified for the selected alloy, device structure and reflow conditions.