SMT Enhanced-Wetting Solder Paste

High-Reliability SMT Solder Paste

Product Positioning

Dawi high-reliability enhanced-wetting SMT solder paste is developed for high-reliability electronic assembly, fine-pitch components, and applications requiring reliable wetting on complex pads. The formulation is optimized to address insufficient QFN side wetting, wetting on OSP finishes, insufficient solder, and poor joint formation during CPU, GPU, and DDR assembly.

The product provides excellent wetting and spreading, enhanced solder rise, stable continuous printing, slump resistance, and reliable joint formation. It is suitable for different PCB surface finishes, component structures, and reflow conditions, including QFN, LGA, BGA, CPU, GPU, DDR, server motherboards, communication equipment, industrial control systems, automotive electronics, and high-end electronic products.

Product Features

• Enhanced wetting: Optimized activation and wetting system improves solder rise and spreading on QFN side terminations, leads, and complex pads.
• Stable printing: Controlled rheology and stencil release support continuous printing and stable volume production.
• Wide wetting window: Suitable for common PCB finishes such as OSP and ENIG under different reflow conditions.
• Slump resistance: Good hot and cold slump control helps reduce bridging and solder-ball risks in fine-pitch assembly.
• Low-voiding option: Low-voiding soldering solutions can be provided for QFN and BGA applications.
• Reliable solder joints: Forms consistent solder joints for high-reliability electronic assembly.
• Multiple powder sizes: Powder size can be selected according to pitch, stencil aperture, and component structure.
• Multiple alloy systems: Alloy selection can be matched to operating temperature, reliability, and process requirements.

Typical Applications

QFN | LGA | BGA | CPU | GPU | DDR | Server Motherboards | Communication Equipment | Industrial Control | Automotive Electronics | High-End Consumer Electronics

For rework and remanufacturing of high-value CPU, GPU, and DDR devices, wetting and solder-rise solutions can be matched to pad oxidation, surface finish, and reflow conditions.

Powder Type / Particle Size

Type 4 (T4): 20–38 μm
Type 5 (T5): 15–25 μm

Alloy Systems

Sn96.5Ag3.0Cu0.5
Sn98.5Ag1.0Cu0.5
Sn99.0Ag0.3Cu0.7