DSP717HF Ultrafine Water-Soluble Solder Paste

Water-Soluble Solder Paste for Advanced Packaging

Product Positioning

Dawi DSP717HF ultrafine water-soluble solder paste combines an active, high-cleanliness water-soluble flux system with Type 6, Type 7, and Type 8 ultrafine solder powders. It is developed for ultrafine pitch, high-density interconnect, and advanced packaging. Post-reflow residue can be removed with DI water.

The product supports small-aperture filling and release, continuous printing, wetting and spreading, slump resistance, and low-voiding solutions.

Core Advantages

• DI-water cleaning: Residue can be removed with deionized water for high-cleanliness advanced packaging.
• Small-aperture release: Rheology is optimized for T6/T7/T8 powder filling, release, and deposit formation.
• Ultrafine-pitch printing: Supports small pads, high-density interconnects, and continuous printing stability.
• Advanced-packaging applications: Covers wafer, flip chip, WLCSP, fan-out, Chiplet, CoWoS/CoPoS, CPO/NPO and related assemblies.

Typical Applications

Wafer Bumping | Flip Chip | WLCSP | Fan-Out | FOWLP | SiP | Chiplet | CoWoS | CoPoS | CPO / NPO | 800G / 1.6T Optical Modules | Mini / Micro LED | HBM | 2.5D / 3D IC | Micro Bump

Powder Type / Particle Size

Type 6 (T6): 5–15 μm
Type 7 (T7): 1–11 μm
Type 8 (T8): 1–8 μm

120 μm Pitch Printing

For ultrafine-pitch applications such as wafer, flip-chip, and bump formation, the existing product information covers 120 μm pitch with a 40 μm gap, addressing aperture filling, release, deposit formation, and continuous printing stability.

Cleaning Guidance

Reference cleaning condition: heated DI water at 55°C with spray pressure of approximately 60 psi. Actual parameters should be optimized according to the flux system, residue level, component stand-off height, pitch, and board complexity.