Dongguan Dawei New Material Technology Co., Ltd. 

高可靠电子装联与先进封装材料解决方案

High-Reliability Electronic Interconnection & Advanced Packaging Material Solutions

成立于2013年，是一家专注于软钎焊电子焊接材料、微电子及先进封装应用材料研发、生产、销售与技术服务于一体的[敏感词]高新技术企业。Founded in 2013, Dongguan Dawei New Material Technology Co., Ltd. (DAWEI New Material) is a National High-Tech Enterprise specializing in the R&D, manufacturing, sales, and technical services of soft soldering materials, microelectronics materials, and advanced packaging application materials.

公司长期致力于电子焊接与先进封装材料的技术研发与应用创新，与[敏感词]有色金属研究院、广州第五研究所保持长期合作，拥有由化学博士、高分子材料专家及专业技术人员组成的研发团队，持续面向高可靠电子装联、微电子及先进封装领域开展材料研发、产品创新与应用技术研究。DAWEI has long been committed to technological innovation and application development in electronic soldering and advanced packaging materials. The company maintains long-term cooperation with the General Research Institute for Nonferrous Metals and Guangzhou Fifth Research Institute, and has established an R&D team comprising Ph.D.-level chemists, polymer materials specialists, and experienced technical professionals. Our research focuses on material innovation and process solutions for high-reliability electronic interconnection, microelectronics, and advanced semiconductor packaging.

公司建设有占地近1000㎡的分析检测中心，设有精密仪器分析室、综合分析室、样品前处理室、化学分析室、高温室等专业功能区域，并拥有一支经验丰富、严谨细致、专业负责的分析研究与检测工程师团队，为材料研发、产品验证、品质控制及可靠性评价提供技术支撑。DAWEI has established an analytical and testing center covering nearly 1,000 m², featuring dedicated laboratories for precision instrumental analysis, comprehensive analysis, sample preparation, chemical analysis, and high-temperature testing. Supported by an experienced and professional team of analytical and testing engineers, the center provides comprehensive technical capabilities for material development, product validation, quality control, and reliability evaluation.

分析检测中心配置数十套专业分析、检测及可靠性试验设备，包括进口傅里叶变换红外光谱仪（FT-IR）、热重分析仪（TGA）、差示扫描量热仪（DSC）、热机械分析仪（TMA），以及导热系数测量仪、能量色散X射线荧光光谱仪（ED-XRF）、气相色谱仪（GC）、无转子硫化仪、激光粒度分析仪等精密分析仪器，同时配置高温湿热试验箱、盐雾试验箱等产品老化及可靠性试验设备。The center is equipped with dozens of professional analytical, testing, and reliability instruments, including imported Fourier Transform Infrared Spectroscopy (FT-IR), Thermogravimetric Analysis (TGA), Differential Scanning Calorimetry (DSC), and Thermomechanical Analysis (TMA) systems. Additional equipment includes thermal conductivity analyzers, Energy Dispersive X-Ray Fluorescence (ED-XRF) spectrometers, Gas Chromatography (GC) systems, rotorless rheometers, laser particle size analyzers, as well as high-temperature and high-humidity test chambers, salt spray test chambers, and other equipment for product aging and reliability testing.

依托持续的研发投入、完善的分析检测能力以及丰富的材料与工艺应用经验，大为新材料致力于为客户提供高可靠电子装联与先进封装材料解决方案，持续推动高端电子焊接及先进封装材料的技术创新与国产化应用。With continuous investment in R&D, comprehensive analytical and testing capabilities, and extensive expertise in materials and process applications, DAWEI New Material is committed to providing high-reliability electronic interconnection and advanced packaging material solutions, while continuously advancing technological innovation and the localization of high-end electronic soldering and advanced packaging materials.