Solder Paste for High-Temperature, High-Humidity and Corrosive Environments

PRODUCT POSITIONING

Dawi harsh-environment high-reliability solder paste is developed for electronic assemblies exposed to high temperature, high humidity, temperature cycling and corrosive environments. It focuses on insulation stability, humidity resistance and resistance to electrochemical migration under matched product and process conditions.

RELIABILITY EVALUATION

Evaluation can include surface insulation resistance, electrochemical migration, high-temperature and high-humidity exposure, temperature cycling and corrosion assessment. Conditions such as -35℃ to +85℃ temperature cycling and 85℃/85%RH can be considered according to the selected product and project.

Test conditions, cycle counts and acceptance criteria are determined by the specific product model and customer project.

TYPICAL APPLICATIONS

Automotive Electronics | ADAS | ECU | BMS | Industrial Control | Communication Equipment | Marine Electronics | Aerospace Electronics | Outdoor Electronics

POWDER SIZE

T4 | T5 | T6

The final powder size, alloy, flux system and verification plan must be selected according to the assembly structure, operating environment and reliability requirements.