Precision Solder Paste for Dispensing, Jetting and Micro-Printing

PRODUCT POSITIONING

Dawi dispensing, jetting and printing solder paste is developed for precision solder deposition, syringe dispensing, high-speed jetting and micro-printing. It is designed to support continuous deposits, consistent dot size, low stringing, low tailing and stable delivery through matched needles or nozzles.

TYPICAL APPLICATIONS

SiP | Mini LED | Micro LED | MIP | Optical Modules | Camera Modules | MEMS | Sensors | Connectors | PCBA Rework | Flip Chip | BGA | CSP | LGA

COMPATIBLE PROCESSES

Dispensing | Jetting | Precision Dispensing | Micro-Dispensing | Selective Solder Deposition

POWDER SIZE

T4 | T5 | T6 | T7

Process settings must be matched to the nozzle or needle diameter, pressure, jetting frequency, deposit volume and material conditioning requirements. Final settings require validation with the selected equipment and product configuration.