IGBT / Power Device Solder Paste

IGBT & Power Semiconductor Solder Paste

Product Positioning

Dawi IGBT and power-device solder paste is developed for IGBT, SiC, MOSFET, power modules, and power-semiconductor packaging. Alloy, powder-size, and flux-system options can be selected according to the device structure and operating temperature.

The product is designed for wetting and spreading, low-voiding performance, continuous printing, stable dispensing, and reliable solder joints. It supports stencil printing and syringe dispensing. High-temperature alloy and low-voiding solutions can be evaluated for high operating temperatures, thermal cycling, and high-current applications.

Product Features

• Low-voiding design: Optimized flux and reflow system for power-device soldering interfaces.
• High-temperature options: Alloy systems for power-semiconductor operation and multiple reflow cycles.
• Wetting performance: Supports uniform and dense solder layers.
• Process compatibility: Supports stencil printing and syringe dispensing.
• Stable printing and dispensing: Controlled rheology and thixotropy support continuous production.
• Thermal-cycle reliability: Material options address interface stability under repeated temperature changes.
• High-strength connection: Balances mechanical strength and interface bonding.
• Multiple alloy options: Alloy systems can be matched to operating temperature, secondary reflow, and reliability requirements.

Typical Applications

IGBT | SiC | MOSFET | Power Modules | Power Semiconductors | Power-Device Die Attach | Automotive Power Electronics | New-Energy Vehicle Controllers | Industrial Power Supplies | Inverters | Charging Modules

Powder Type / Particle Size

Type 4 (T4): 20–38 μm
Type 5 (T5): 15–25 μm

Alloy Systems

Sn5Pb92.5Ag2.5
Sn-Sb series | High-temperature lead-free soldering systems

Reliability and Process Evaluation

Low Voiding: Optimized for dense solder layers and reliable connections.

High-Temperature Operation: Alloy options support power-device operation and multiple reflow requirements.

Process Stability: Supports stencil printing and syringe dispensing.

High-Strength Connection: Wetting and interface bonding are considered for long-term reliability.