Die Attach Solder Paste

Solder Paste for COB, LED and Precision Die Attach

Product Positioning

Dawi die attach solder paste is developed for COB flip-chip die attach, LED packaging, and precision electronic-device soldering. It is suitable for COB LED strips, COB light sources, LED segment displays, Mini LED, flip-chip devices, and precision die attach and dispensing applications.

Type 6 and Type 7 ultrafine powder systems and multiple alloy options support continuous dispensing, wetting, slump resistance, low-voiding performance, and reliable solder joints.

Product Features

• Low-voiding options: Flux and reflow systems can be matched to device structure, alloy, and reflow conditions.
• Stable continuous dispensing: Rheology and thixotropy are optimized for long production runs.
• Wetting performance: Designed for small pads and precision devices.
• 24-hour operation: Verified product models can maintain thixotropy, dispensing, and bonding performance during 24-hour continuous operation.

Typical Applications

COB LED Strips | COB Light Sources | LED Segment Displays | Mini LED | Flip Chip | LED Die Attach | COB Die Attach | Precision Electronic Devices | Die Bonding

Powder Type / Particle Size

Type 6 (T6): 5–15 μm
Type 7 (T7): 2–11 μm

Alloy Systems

Sn96.5Ag3.0Cu0.5 (SAC305)
SnBiAgX
Sn90Sb10

Powder type and alloy system should be selected according to the device structure, soldering temperature, pad size, and reliability requirements.

Technical Information

Application: Dispensing / Dotting / Precision Printing

Powder system: T6 / T7 ultrafine solder powder

Flux classification: IPC J-STD-004 ROL0 systems are available for specified product models; confirm the applicable model in its technical specification.